Fraunhofer institutes develop NeurOSmart, integrating LIDAR sensing, embedded AI and neuromorphic chips for energy-efficient, real-time industrial robotics.

Fraunhofer IPMS unveils a compact AI-based hyperspectral camera that enables real-time material and quality analysis for industrial and agricultural applications.

Fraunhofer, with TSRI, develops FeMFET-based nanosheet memory under 3 nm, enabling in-memory computing for energy-efficient AI chips in smartphones, cars, and medical devices.

Researchers at the Fraunhofer IFF have developed cognitive robot capabilities that can handle complex tasks in manufacturing that were previously impossible to automate.

Fraunhofer will showcase AI for industrial innovation, energy solutions, circular economy, smart systems, and materials efficiency.

Fraunhofer researchers are developing solutions for automated, nondestructive robotic disassembly of electronics for remanufacturing and material recycling that will help establish an advanced circular economy.

In the 3D-InAus project, researchers from Fraunhofer are using a LiDAR laser on a mobile robot, emitting laser pulses to measure distances.

As part of the HOT project (High-performance transparent and flexible microelectronics for photonic and optical applications), scientists from the Fraunhofer Institute for Photonic Microsystems IPMS have developed a semi-transparent microdisplay.

The Fraunhofer IPMS, Dresden and the Max Planck Institute for Microstructure Physics, Halle, are collaborating on innovative spin-based memory and logic components that operate at low temperatures.

The Microdisplays and Sensors business unit at the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP will be integrated into the Fraunhofer Institute for Photonic Microsystems IPMS.