Join the 155,000+ IMP followers

Infineon News

New i-ToF imager enables smallest 3D camera systems with improved quantum efficiency at optimized cost

Infineon Technologies AG, in collaboration with 3D time-of-flight specialist and premium partner pmdtechnologies, introduces the IRS2976C Time of Flight (ToF) VGA sensor, a performance-enhancing evolution of the IRS2877C ToF VGA sensor and novel member of the REAL3 product family.

NEC Corporation News

QUALCOMM AND NEC FURTHER THE COMMERCIALIZATION OF VIRTUALIZED AND OPEN RAN

New NEC virtualized distributed unit (vDU) solution to incorporate the Qualcomm® X100 5G RAN Accelerator Card. Qualcomm® 5G RAN Platforms will provide high performance, energy-efficiency, and low latency for NEC products.

Huber+Suhner News

POLATIS® 576 OPTICAL CIRCUIT SWITCH MAKES ITS DEBUT AT OFC 2023

The latest addition to the POLATIS all-optical switch portfolio from HUBER+SUHNER has been designed to provide operators with 80% more capacity than any other solution on the market.

Samsung News

SAMSUNG ELECTRONICS INTRODUCES STANDARDIZED 5G NTN MODEM TECHNOLOGY

Samsung plans to integrate this technology into the company’s Exynos modem solutions, accelerating the commercialization of 5G satellite communications and paving the way for the 6G-driven Internet of Everything (IoE) era.

Keysight technologies News

KEYSIGHT AND ANALOG DEVICES COLLABORATE TO ADVANCE 6G TECHNOLOGY

The collaboration brings together high-performance solutions and expertise across a wide range of emerging technology domains to realize the industry's evolving 6G vision.

Telit News

TELIT CINTERION EXPANDS 5G MODULE PORTFOLIO WITH THE FE990

The series is designed for bandwidth-intensive fixed and mobile applications such as industrial IoT, mobile routers, private enterprise networks and residential broadband.

Join the 155,000+ IMP followers