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Contrinex News

RFID IO-LINK

The IO-Link family of high frequency read/write modules (HF RWMs) with IO-Link interface V 1.1 has been designed for easy, cost-effective integration into existing control systems.

MICRO EPSILON News

3D INSPECTION OF UNPOPULATED PCBS

For fully automated inline inspection of unpopulated PCBs, 3D snapshot sensors from Micro-Epsilon are used. Unlike conventional test systems such as microscopes, they are more cost-efficient and work significantly faster. For high-end ceramics substrates, manufacturing tolerances up to 2 µm apply which can be monitored using surfaceCONTROL sensors.

Rohde & Schwarz

Rohde & Schwarz introduces R&S VSESIM-VSS that combines EDA simulation with hardware testing

T&M expert Rohde & Schwarz and Cadence have collaborated on a solution aimed at simplifying the engineering process from RF design to implementation and enhancing accuracy by using realistic signals for both simulation and testing. The new R&S VSESIM-VSS signal creation and analysis tool speeds up the development process for RF components. It is particularly useful for customers in the wireless, automotive, and aerospace and defense industries as well as for manufacturers of active components and systems.

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