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TE Connectivity News

TE Connectivity’s AMPMODU 2 mm wire-to-board crimp receptacles and shrouded headers free up space on printed circuit boards

TE Connectivity (TE), a world leader in connectivity and sensors, is freeing up valuable space on printed circuit boards (PCBs) for design engineers with its new compact AMPMODU wire-to-board receptacles with crimp contacts and shrouded headers. With centerline distances of 2 mm, they occupy 38 percent less space on a PCB than connectors with a 2.54 mm [0.100”] centerline.

SCHUNK News

Sensitive toolholder

SCHUNK is entering a new era of toolholding: In September, delivery of the sensory hydraulic expansion toolholder iTENDO, the most sensitive toolholder on the market, will begin.

Emerson News

Emerson Invests in inmation Software

Investment will enhance Emerson’s Plantweb™ digital ecosystem with advanced data management capability to help span the IT/OT needs of customers.

TDK News

TDK announces ultra-high AOP Analog MEMS microphone, ICS-40638

TDK Corporation introduces the InvenSense ICS-40638 MEMS analog microphone. The ICS-40638 microphone offers an ultra-high Acoustic Overload Point (AOP) of 138 dB Sound Pressure Level (SPL), exceptionally efficient 170 µA low power operation and high Signal to Noise Ratio (SNR) of 63 dB in a small 3.5 mm x 2.65 mm x 0.98 mm bottom port surface‐mount package.

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