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MICRO EPSILON News

Thickness and structure measurement of solar wafers with MICRO EPSILON

The production of solar wafers starts with the raw wafers that are sawn from the so-called ingots. These must comply with a specified thickness of about 180 µm to be processed further as a good part.

SCHUNK News

SCHUNK: AUTOMATION THAT WORKS

SCHUNK offers a comprehensive portfolio with all the necessary components, and also the experience and know-how for efficient automation solutions for any requirement.

Leuze

Technology report: Methods for risk assessment

The European Machinery Directive requires that a risk analysis be performed for every machine before being brought to market. The convergence of IT and OT as well as the rapid technological development has made it necessary to revise the Machinery Directive. The result is the new Machinery Regulation: It will replace the Machinery Directive as the legal foundation. It contains additional requirements on the risk analysis. In addition to the general procedure for the risk analysis, various processes for the risk assessment are introduced and their properties explained in the following.

Hexagon Manufacturing Intelligence News

THE FOUR BUILDING BLOCKS OF THE INDUSTRIAL METAVERSE

Stephen Graham, Executive Vice President and General Manager, Nexus, Hexagon, introduces us to the 4 building blocks of the industrial metaverse, highlighting some of the key issues.

Leuze

A Technology report

An innovative solution by Leuze secures the transfer stations by means of dynamic protective field adjustment. This makes additional safety measures such as barriers and fences unnecessary.

Leuze

Stay flexible safely

Different material widths, varying material positions or partially loaded pallets pose special challenges for transfer station access guarding. For this, Leuze relies on the concept of dynamic format adaptation. In this way, productivity and safety can be optimally harmonized.

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