Congatec introduces aReady.COM, its first product family, enhancing the implementation of embedded and edge computing technology with high-performance embedded building blocks, including Computer-on-Modules (COM) to cloud.
SICK has unveiled a pioneering compressed air monitoring system that accurately predicts where significant energy cost-savings can be made by fixing air leaks and removing wastage across entire production and logistics facilities.
The Microdisplays and Sensors business unit at the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP will be integrated into the Fraunhofer Institute for Photonic Microsystems IPMS.
Flexxbotics has announced it will demonstrate its breakthrough solutions for advanced robotic machine tending at the Universal Robots Innovate to Elevate online event on March 21, 2024.
Comau will participate as a Platinum Sponsor at the 2024 edition of the European Robotics Forum (ERF), being held in Rimini (Palacongressi) from the 13th to the 15th of March, and organized by euRobotics.