Meltio, - a disruptive wire-laser metal deposition additive manufacturing technology (DED) leader - has today taken a giant leap towards facilitating the use of its unique metal 3D printing solutions.
Intel’s next-gen server platform in 2024 will deliver strong P-core performance for critical workloads, including AI, and innovative E-core efficiency to compete in the cloud.
The accessibility of RISC-V has started a revolution and, thanks to its open architecture, allows developers to design processors tailored to specific requirements. The Fraunhofer IPMS also offers a processor IP based on the RISC V instruction set architecture.
Berlin is the place to be in 2023, especially for the microwave industry. The European Microwave Week (EuMW) is Europe's premier annual microwave, RF, wireless and radar event and is coming to the German capital.
Innodisk, a leading global AIoT solution provider, announces the release of the first nanoSSD PCIe 4TE3 in response to the increasing demands of edge AI miniature design and high computing performance.
Version 5.30 of dataFEED OPC Suite from Softing Industrial offers two new features: an OPC UA tunnel to increase security for OPC Classic communication plus support for InfluxDB databases.
With the extension of its production location in Jimbolia, Romania, the FAULHABER Group is taking a significant step to boost its competitiveness on the market and at the same time to satisfy the growing demand for its high-quality products.
MediaTek’s Genio 700 (MT8390) is a powerful edge AI IoT platform designed for industrial, smart home, interactive retail, and commercial applications. It offers responsive edge processing, advanced multimedia capabilities, Artificial Intelligence and connectivity.