The use of Dymax SpeedMask®, available in the UK from adhesives specialist Intertronics, has enabled German aircraft engine manufacturer MTU Aero Engines AG to reduce its masking process time from four hours down to just 14 minutes.
U-blox, a global provider of leading positioning and wireless communication technologies and services, announced the certification of its SARA-R5 series on all the Japan MNOs’ LTE-M networks.
The Global Certification Forum and Telecommunications Technology Association has announced the activation of oneM2M Release 2 within GCF’s certification programme for oneM2M. Release 2 extends the scope of the oneM2M standard to meet the needs of the global IoT market.
NXP Semiconductors has announced the i.MX 95 family, the newest addition to its i.MX 9 series of applications processors. The new i.MX 95 family combines high-performance compute, immersive Arm® MaliTM-powered 3D graphics, an innovative new NXP accelerator for machine learning, and high-speed data processing.
Allied Electronics & Automation, a trading brand of RS Group plc, a global omni-channel provider of product and service solutions, announces ready-to-ship solutions for medical industry applications from ABB Robotics, Bürkert Fluid Control Systems, Keystone Technologies, and MicroCare.
CEVA, Inc, the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions has announced that LG Electronics (LG) has licensed and deployed the CEVA-XM4 intelligent vision DSP in its Edge AI system-on-chip 'LG8111' to advance the user experience of a new generation of smart home appliances.
With rapid workplace transformation evident across industries, whether that’s moving to hybrid working or adopting new technologies, what can we expect from 2023? Anders Beck, Vice President of Strategy and Innovation at Universal Robots, discusses five predictions for the coming year.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and eYs3D Microelectronics, a fabless semiconductor design house that focuses on end-to-end hardware and software systems for computer vision, including advanced vision-processing System-on-Chip (SoC) devices, will reveal the results of their collaboration on high-quality machine vision at CES 2023 in Las Vegas on January 5-8.
Through their HoloLayouts software, researchers at the Fraunhofer Institute for Manufacturing Engineering and Automation IPA have developed an application in which multiple people can collaborate interactively on creating factory layouts that use space efficiently. The factory planning process can be experienced in a virtual environment, with changes made live and in real time.