Rutronik Elektronische Bauelemente GmbH has signed a worldwide distribution agreement with one of China's leading SoC suppliers, Fuzhou Rockchip Electronics Co, Ltd. Thus, Rutronik is the authorized distributor from Europe in the Rockchip distribution network.
Amidst the COVID-19 pandemic where the ability to work from home has become an absolute necessity, NEXCOM can now help telecom and data centers across the world virtualize and expand capacity with its new NC 220FMS3 100GbE NIC module.
The Siemens’ Packaging Toolbox is now available in its entirety for the Simatic S7-1500 controller in the TIA Portal engineering framework. It offers users packaging specific libraries which can be integrated into existing or new machine applications as well as program blocks. The Toolbox supports international standards such as OMAC, PackML and Weihenstephan Standards. By adding or modifying function blocks it can be adapted to suit individual requirements, while at the same time saving the user time during engineering and commissioning through tested functions and software solutions.
Vision Components manufactures intelligent laser profilers for a wide range of applications.
The standard VCnano3D-Z models cover working distances from 50 mm to 2025 mm and between 40 mm and 1250 mm horizontal field of view. They provide high precision with resolutions down to 10 µm.
Greif – a global leader in industrial packaging products and services – is now offering its GCube Connect IBCs (Intermediate Bulk Containers), which are used for the storage and transport of liquids and free-flowing materials, with Sigfox 0G network connectivity.