21
'20
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Parker News
21
'20
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Mentor News
New Analog FastSPICE eXTreme technology boosts verification performance by up to 10X
Innovative functionality available with Mentor’s Analog FastSPICE platform can dramatically accelerate nanometer-scale verification of large, post-layout analog designs.
21
'20
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Bell-Everman
New Low-Cost, High-Performance Alternative to Rod Actuators and Pneumatic Cylinders
Bell-Everman has launched ServoBelt™ RA, a new high-performance, drop-in replacement actuator designed for applications that have traditionally used rod actuators, pneumatic cylinders or even linear motors. Unlike traditional rod actuators, ServoBelt RA is fully guided along the entirety of its stroke, making it more resistant to off-axis loads and more stable in on-axis moves.
20
'20
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PROFIBUS News
Live Webinar: Digital Transformation with PROFINET
PROFINET: The Communication Standard for the digital Transformation.
20
'20
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Infineon News
Extremely small power-saving 3D magnetic sensor opens up new design options
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will expand its XENSIV™ 3D magnetic sensor family TLx493D. At its in-house digital trade show "Virtual Sensor Experience", the chipmaker will present a new device for industrial and consumer applications: the TLI493D-W2BW.
20
'20
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Siemens News
Siemens and SAP Join Forces to Accelerate Industrial Transformation
Siemens and SAP announced a new partnership that will leverage their industry expertise and bring together their complementary software solutions for product lifecycle, supply chain and asset management so their customers can deliver new innovation and collaborative business models that will accelerate industry transformation globally.
18
'20
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MURATA News
Murata’s Bluetooth® module with VitaNet Suite enables cloud-centric IoT device
Murata Manufacturing Co., Ltd. (Head Office: Nagaokakyo City, Kyoto Prefecture, Japan; hereinafter “Murata”) has completed compatibility verification of the MCU*1 embedded Bluetooth® Module (MBN52832) (hereinafter “the Murata Module”) with VitaNet Suite, the secure IoT platform that VitaNet, Inc. (Head Office: California, USA; hereinafter "VitaNet") will begin offering in July 2020.
18
'20
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Autodesk News
Autodesk’s Second Investment in Factory_OS Fuels Innovation in Industrialized Construction, Automation & Workforce Training
I admire when companies seek to disrupt their industries from within, especially when their efforts reinforce that business can be a force for good. With its focus on prefabrication, Factory_OS is a modular construction start-up at the forefront of innovation and social good, which is why I’m thrilled to share Autodesk is building on its first investment in the company, and today announcing a second investment in Factory_OS.
18
'20
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Balluff News
IO-Link Adds Flexibility and Control to Capacitive Smart Sensor
Newest Balluff Capacitive Sensor Operates in IO-Link or Standard Mode.
18
'20
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Kuka News
